Chipkind Electrónica
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    Chipkind Electrónica Chipkind Electrónica

    Zócalos para circuitos integrados

    Fabricante Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Foto Parte del fabricante # Disponibilidad Precio Cantidad Hoja de datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    ICO-324-JGG

    ICO-324-JGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-324-JGG Datasheet

    Hoja de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-624-JGG

    ICA-624-JGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-624-JGG Datasheet

    Hoja de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    614-41-320-31-007000

    614-41-320-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-41-320-31-007000 Datasheet

    Hoja de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-420-31-007000

    614-41-420-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-41-420-31-007000 Datasheet

    Hoja de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-320-31-007000

    614-91-320-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-91-320-31-007000 Datasheet

    Hoja de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-420-31-007000

    614-91-420-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-91-420-31-007000 Datasheet

    Hoja de datos

    614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-328-41-006000

    116-41-328-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    116-41-328-41-006000 Datasheet

    Hoja de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-428-41-006000

    116-41-428-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    116-41-428-41-006000 Datasheet

    Hoja de datos

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-628-41-006000

    116-41-628-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    116-41-628-41-006000 Datasheet

    Hoja de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-328-41-006000

    116-91-328-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    116-91-328-41-006000 Datasheet

    Hoja de datos

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-428-41-006000

    116-91-428-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    116-91-428-41-006000 Datasheet

    Hoja de datos

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-628-41-006000

    116-91-628-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    116-91-628-41-006000 Datasheet

    Hoja de datos

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-318-31-002000

    614-41-318-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-41-318-31-002000 Datasheet

    Hoja de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-318-31-002000

    614-91-318-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-91-318-31-002000 Datasheet

    Hoja de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-318-31-007000

    614-41-318-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-41-318-31-007000 Datasheet

    Hoja de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-318-31-007000

    614-91-318-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-91-318-31-007000 Datasheet

    Hoja de datos

    614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    410-93-214-10-002000

    410-93-214-10-002000

    SOCKET DUAL IN-LINE SLDRTL 14POS

    Mill-Max Manufacturing Corp.

    0
    RFQ
    410-93-214-10-002000 Datasheet

    Hoja de datos

    410 Tube Active Zig-Zag, Right Stackable 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    20-8730-310C

    20-8730-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    0
    RFQ
    20-8730-310C Datasheet

    Hoja de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8770-310C

    20-8770-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    0
    RFQ
    20-8770-310C Datasheet

    Hoja de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    126-41-320-41-001000

    126-41-320-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    126-41-320-41-001000 Datasheet

    Hoja de datos

    126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 566567568569570571572573...955Next»

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